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OptiCon SPI-Line 3D

OptiCon SPI-Line 3D

In comparison to other solder paste inspection systems, the OptiCon SPI-Line 3D provides a true accurate measurement of applied solder paste. The solder paste printing is inspected for form, height, surface area, bridges, volume, x/y offset and coplanarity.

In addition to high detection precision, the SPI system provides you with a test speed appropriate to industrial standards.

The easy-to-use software guarantees a fast generation of test programs.

Utilizing the OptiCon SPI-Line 3D opens new opportunities for your processes:
  • Close-loop to paste printer
  • Connection to AOI/AXI repair station
 
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