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ACCRETECH

Products:
 
  • Wafer Manufacturing System - Variety of products line for wafer manufacturers including Wafer Slicing Machine and Wafer Edge Grinding Machine.
     
  • CMP- CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
     
  • Wafer Probing Machines - Phenomenal levels of throughput have been made possible with the synergistic effects of high-speed wafer handling enabled by a new algorithm, and the high-speed and low-noise XY Stage enabled by a newly developed purpose-built drive unit for probes.
     
  • Polish Grinders - The product of a unique ACCRETECH innovation, this Polish Grinder combines the wafer thinness required for IC cards and three-dimensional mounting technology with damage removal functions in a single device.
     
  • Wafer Dicing Machines - ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
 
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